Rien Oortgiesen, Senior FAE at Agile Analog
In this blog post, as the new Senior Field Application Engineer at Agile Analog, I would like to introduce myself and explain a bit about my experience in the semiconductor sector.
Many people say that there were early indications during their childhood about which career they might eventually choose to follow. That is definitely true for me. From a very early age I was interested in designing and developing new things. My parents had their own company where they made wooden garden houses. Most of the production machinery was either built by them or customized for specific needs. I think that has inspired me a lot - more than I would have admitted when I was younger! Perhaps because of this, building and making things comes quite naturally to me. Working in the field of electronics is perfect for that, especially semiconductors, where you are really part of building things from the ground up.
After I studied Electrical Engineering, specializing in IC Design, at the University of Twente in the Netherlands, I worked as a Mixed-Signal IC Designer, before going on to Merus Audio, a start-up in Denmark where I turned to Application Engineering. Following Merus Audio’s acquisition by Infineon, I stepped into more of a Management role overseeing applications for Class-D Audio at Infineon. I then worked as a System Engineer for Jabra, making consumer end-products combining several engineering disciplines. I am proud that throughout my career I have gained a broad range of experience, spanning analog electronics for chips to system design for consumer end-products, both in start-up and big corporations.
Back when I was working on analog designs I often wondered how this could be done in a better and faster way, by automatically generating and re-using IP blocks. Moving to a new technology node requires a lot of time and effort to re-design the same piece of circuitry. When I heard about Agile Analog and their unique Composa tool I was immediately intrigued by the technology, which exactly addresses this problem. With my background in chip design and application engineering, the role as Senior Field Application Engineer was a perfect fit for me.
I am looking forward to learning everything I can about the Composa technology and all of the Agile Analog IP. Product demand is really high at the moment. The fact that Agile Analog offer process agnostic IP that can be customized, optimized and easily integrated, are big things in the world of chip design. Time-to-market is crucial, chip area and power consumption are also important parameters. Technology nodes move fast and analog chip design is notoriously difficult - so you need experienced analog chip designers to get the job done. Agile Analog is solving that problem. I am keen to be supporting our customers, understanding the technical needs of the market, matching that with the IP offerings we have and shaping our roadmap.
The semiconductor industry is where real cutting-edge electronics is made. It is the place to be if you are interested in new technologies and new applications. I am excited about this new stage in my career as I believe that advances in analog IP will have a key role to play.
If you are looking for an exciting new opportunity in analog design, please check out the Agile Analog Careers web page.
If you would like to meet me and the Agile Analog team at upcoming GlobalFoundries and TSMC events, please take a look at our Events web page.
Agile Analog is transforming the world of analog IP with Composa™, its innovative, highly configurable, multi-process analog IP technology. Headquartered in Cambridge, UK, with a growing number of customers across the globe, Agile Analog has developed a unique way to automatically generate analog IP that meets the customer’s exact specifications for any foundry and on any process, from legacy nodes right up to the leading edge. The company provides a wide range of novel analog IP and subsystems for data conversion, power management, IC monitoring, security, and always-on IP, with applications including data centers/HPC, IoT, AI, quantum computing, automotive, and aerospace. The digitally wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time, and costs and helping to accelerate innovation in semiconductor design.
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